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  power transistor arrays 1 publication date: march 2004 sjk00012aed parameter symbol rating unit collector-base voltage (emitter open) v cbo 30 5v collector-emitter voltage (base open) v ceo 30 5v emitter-base voltage (collector open) v ebo 5v collector current i c 4a peak collector current i cp 8a collector power dissipation p c 15 w t a = 25 c 2.4 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector-emitter voltage (base open) v ceo i c = 5 ma, i b = 02535v collector-base cutoff current (emitter open) i cbo v cb = 25 v, i e = 0 100 a emitter-base cutoff current (collector open) i ebo v eb = 5 v, i c = 02ma forward current transfer ratio h fe1 v ce = 3 v, i c = 0.5 a 1 000 ? h fe2 * 1 v ce = 3 v, i c = 3 a 1 000 10 000 collector-emitter saturation voltage v ce(sat) i c = 3 a, i b = 12 ma 2.0 v i c = 5 a, i b = 20 ma 4.0 base-emitter saturation voltage v be(sat) i c = 3 a, i b = 12 ma 2.5 v transition frequency f t v ce = 10 v, i c = 0.5 a, f = 1 mhz 20 mhz turn-on time t on i c = 3 a 0.3 s storage time t stg i b1 = 12 ma, i b2 = ? 12 ma 3.0 s fall time t f v cc = 20 v 1.0 s energy handling capability * 2 e s/b i c = 2 a, l = 100 mh, r be = 100 ? 200 mj electrical characteristics t c = 25 c 3 c note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * 1: rank classification * 2: e s/b test circuit rank free p q h fe 1 000 to 10 000 2 000 to 10 000 1 000 to 5 000 PUA3122 (pu3122) silicon npn triple diffusion planar type darlington for power amplification features ? built-in zener diode (30 v) between collector and base ? small variation in withstand pressure ? large energy handling capability ? high-speed switching ? npn 3 elements absolute maximum ratings t c = 25 c x l r be mercury relay y z note) the part number in the parenthesis shows conventional part number. unit: mm 20.2 0.3 2.54 0.2 7 2.57 = 17.78 0.25 12345678 1.0 0.25 0.5 0.15 0.8 0.25 c 1.5 0.5 0.5 0.15 9.5 0.2 8.0 0.2 4.4 0.5 1.65 0.2 solder dip 5.3 0.5 4.0 0.2 1: emitter 2: base 3: collector 4: base 5: collector 6: base 7: collector 8: emitter sip8-a1 package maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
PUA3122 2 sjk00012aed i c ? v ce v ce(sat) ? i c v be(sat) ? i c h fe ? i c guidance load characteristic safe operation area 0 160 80 120 40 0 20 16 12 4 8 ( 1 ) t c = t a ( 2 ) with a 50 50 2 mm al heat sink ( 3 ) with a 50 25 2 mm al heat sink ( 4 ) without heat sink ( 1 ) ( 2 ) ( 3 ) ( 4 ) collector power dissipation p c ( w ) ambient temperature t a ( c ) 05 4 13 2 0 2 1 3 4 5 6 t c = 25 c i b = 2.0 ma 1.6 ma 1.8 ma 1.4 ma 1.2 ma 1.0 ma 0.8 ma 0.6 ma 0.4 ma 0.2 ma collector current i c ( a ) collector-emitter voltage v ce ( v ) 0.01 0.1 1 10 0.01 100 i c / i b = 250 0.1 1 10 25 c ? 25 c t c = 100 c collector-emitter saturation voltage v ce(sat) ( v ) collector current i c ( a ) 0.01 0.1 1 10 0.01 100 i c / i b = 250 0.1 1 10 25 c 100 c t c = ? 25 c base-emitter saturation voltage v be(sat) ( v ) collector current i c ( a ) 0.01 0.1 1 10 v ce = 3 v 10 5 10 4 10 3 10 2 10 ? 25 c t c = 100 c 25 c forward current transfer ratio h fe collector current i c ( a ) 1 10 100 1 000 0.01 100 0.1 1 10 r be = 100 ? t c = 25 c 200 mj collector current i c ( a ) coil l (mh ) 1 10 100 1 000 0.01 0.1 1 10 100 non repetitve pulse t c = 25 c ( per circuit ) t = 10 ms t = 1 ms i cp collector current i c ( a ) collector-emitter voltage v ce ( v ) p c ? t a internal connection 1 8 2 35 4 7 6 maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/


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